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Physical Dimensions
SOT-23
1.30+0.20
2.92±0.20
3
-0.15
1.40
0.95
2.20
1
2
(0.29)
0.95
0.60
0.37
1.90
0.20
A B
1.90
LAND PATTERN
RECOMMENDATION
1.00
1.20 MAX
(0.93)
SEE DETAIL A
0.10
0.00
C
0.10
C
2.40±0.30
NOTES: UNLESS OTHERWISE SPECIFIED
GAGE PLANE
A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
0.23
0.08
0.20 MIN
(0.55)
0.25
SEATING
PLANE
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M - 1994.
E) DRAWING FILE NAME: MA03DREV10
SCALE: 2X
Figure 8. 3LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packaging/tr/SOT23-3L_tr.pdf .
? 2010 Fairchild Semiconductor Corporation
BSS138K Rev. 1.3.0
5
www.fairchildsemi.com
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